CVE-2026-16101
HIGH
MEDIUM
Priority: 0.03
BB Relevance:
63/100
Published: 2026-08-13
Modified: 2026-10-23
First seen: 2026-10-29
Status: active
Attack Surface
Adjacent
Low Complexity
No Auth
No Interaction
Conf. Impact
Integ. Impact
CVSS Vector Breakdown
AV:
Adjacent
AC:
Low
PR:
None
UI:
None
S:
Unchanged
C:
High
I:
High
A:
High
Description
Spoofing an already bonded device can force either RS9116W or SiWx917 to re-pair/bond with a rogue device. See V1 in BLERP paper below