CVE-2023-33063
CISA KEV
ACT NOW
Priority: 0.00
BB Relevance:
0/100
Published: N/A
Modified: N/A
First seen: 2026-10-29
Status: pending_score
Description
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
CISA Known Exploited Vulnerability
Vendor / Product
Qualcomm — Multiple Chipsets
Date Added
2023-12-05
Remediation Due
2023-12-26
This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063